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Kapabilitet |
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Board
Thickness
Ability |
Minimum
Board
Thickness:0.2mm |
Maximum
Board
Thickness:3mm
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Processing Size |
Minimum
Size:10×10 mm |
Maximum Size:700×600 mm
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Copper
Thickness Processing |
Maximum
Copper Thickness:4OZ |
Thinnest Copper Thickness:0.5OZ
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Hole
Diameter Ability
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Minimum
Hole Diameter:ø0.25
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Most Difficult Ratio:5:1(Board thick / Hole diameter) |
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Electric
Conductive Pattern |
Minimum
Trace Width:0.1mm(4mil) |
Minimum Trace Width Spacing:0.1mm(4mil)
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Solder
Resist Coating |
Minimum
Solder Resist Bridge:0.1mm(4mil)
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Buried Hole:100% |
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V-cut
Ability |
Thinnest
Board:0.4mm |
Between Multi-layers Registration:±2mil
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Whole
Pattern Displacement
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±2mil |
Monthly Production Ability:30(ft2) |
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Minimum
Annular Ring Spacing
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0.15mm(6mil) |
Minimum Annular Ring Spacing:0.3mm(12mil) |
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Thinnest Multi-layer Board:0.4mm |
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